Thermally Conductive Structural Adhesive
Fangying’s thermally conductive structural adhesive is a high-thermal-conductivity, high-bonding-strength adhesive made from A/B two-part liquids. After mixing at a 1:1 ratio, it cures and diffuses heat between chips and heat sinks, lowering junction temperature and extending chip life. It can cure naturally at room temperature or with heat curing, and bonds heat sinks firmly onto PCBs — with strength high enough to replace screw-based fixing structures.
Solvent-free with no volatiles and high EMC compatibility, it is a reliable choice for structural bonding and thermal management in electronics assembly, supporting automated dispensing, stencil printing and manual smearing.
Key performance features
- High adhesive strength — bonds heat sinks onto PCBs, strong enough to replace screw fixings.
- High thermal conductivity — 1–3 W/m·K heat diffusion between chips and heat sinks.
- Stable material matrix — reliable long-term performance in service.
- High EMC compatibility — safe and stable in electromagnetic environments.
- Solvent-free, no volatiles — clean and safe for assembly environments.
- Room-temperature or heat curing — flexible process options for different production lines.
- Automated application — dispensing, stencil printing or manual smearing.
Typical specifications
| Thermal conductivity | 1 – 3 W/m·K |
| Form | A/B two-part liquid, mixed at 1:1 |
| Curing | Natural (room temperature) or heat curing |
| Bonding | Fixes heat sinks onto PCBs; replaces screw-based structures |
| Compliance | RoHS, halogen-free, HF-controlled |
| Application method | Automated dispensing / stencil printing / manual smearing |
| Packaging | Syringe / cartridge / jar, per your volume |
| Volume | From prototype samples to high-volume production |
Typical applications
- Power modules — structural bonding and heat dissipation in power electronics.
- LCD backlight modules — reliable mounting and thermal management in displays.
- Battery modules — bonding between battery modules for heat spread and insulation.
- Water-cooling plates — secure bonding and heat transfer in liquid cooling systems.
- Cell-to-cell bonding — heat dissipation and thermal insulation between battery cells.
Frequently asked questions
What is the thermal conductivity of this structural adhesive?
1 – 3 W/m·K, confirmed on the material datasheet for each grade.
Is it a two-part adhesive?
Yes. It is an A/B two-part liquid adhesive mixed at a 1:1 ratio before curing.
Can it replace screw fixings?
Yes. It bonds heat sinks onto PCBs with high adhesive strength, strong enough to replace screw-based fixing structures.
How does it cure?
It can cure naturally at room temperature or with heat curing, offering flexible process options.
Is it safe and environmentally compliant?
Yes. It is solvent-free with no volatiles, and complies with RoHS, halogen-free and HF-controlled requirements.
Send us your application details and we confirm the right grade, packaging and quotation. Samples available within 3–7 days.