Ultra-High Thermal Conductivity Silicone Thermal Pads
Ultra-high thermal conductivity silicone thermal pads are advanced thermal interface materials with a thermal conductivity of 8–15 W/m·K. Made with specially developed nano-material powder filling, they greatly increase thermal conduction paths while retaining excellent electrical insulation and temperature resistance. The pads conformably fill the gap between heat-generating components and heat sinks, delivering a reliable heat transfer path from the source to the cooling solution.
As a precision die-cutting manufacturer, Fangying converts these high-performance pads into finished parts that drop straight into your assembly — cut to your exact shape, from a single prototype to millions of pieces on the same tooling.
Key performance features
- Ultra-high thermal conductivity — 8–15 W/m·K for high-power heat dissipation.
- Self-adhesive — simplifies assembly without additional adhesive layers.
- Low thermal resistance — efficient heat transfer across the interface.
- Low oil bleed, high reliability — stable long-term performance under continuous operation.
- High electrical insulation — safe for direct contact with electronic components.
- Excellent temperature resistance — reliable over a wide operating range.
Typical specifications
| Thermal conductivity | 8 – 15 W/m·K |
| Typical thickness | 0.1 – 15.0 mm (customizable) |
| Compliance | RoHS, halogen-free, HF-controlled |
| Die-cutting tolerance | ±0.05 – 0.3 mm (tolerance confirmed after DFM review) |
| Part size | Custom sizes per your drawing; large parts on flat-bed press, long runs on rotary |
| Shapes | Any 2D contour from your DXF, DWG, STEP or dimensioned PDF |
| Cutting methods | Rotary die cutting, flat-bed die cutting, kiss cutting on the liner |
| Presentation | Sheets, rolls, tape-and-reel, individual pieces, or multi-up on one liner |
| Volume | From one prototype piece to millions of parts per year |
Typical applications
- 5G industry — base stations, antennas and RF modules with high power density.
- Aerospace — avionics and power electronics under demanding thermal loads.
- New energy vehicles — battery packs, BMS and inverters.
- UAV / drones — compact power modules and imaging systems.
- Communication equipment — switches, routers and optical modules.
- Precision optics — laser and imaging systems requiring controlled heat paths.
- High-speed storage devices — SSDs and memory modules in servers and data centers.
Frequently asked questions
What is the thermal conductivity of these pads?
8 – 15 W/m·K, confirmed on the material datasheet for each grade.
Can you die cut the pads into custom shapes?
Yes. We cut any 2D contour from your DXF, DWG, STEP or dimensioned PDF with rotary or flat-bed die cutting, from prototype to mass production.
Do the pads have self-adhesive properties?
Yes. The pads are self-adhesive, and we can also apply pressure-sensitive adhesive on request for automated assembly.
Are the materials compliant with environmental standards?
Yes. This series complies with RoHS, halogen-free and HF-controlled requirements.
Send us your drawing and we confirm the exact shape, tolerance and packaging in the quotation. Samples available within 3–7 days.