Thermal Conductive Silicone Pad
Conventional silicone thermal pads are soft, flexible thermal interface materials with excellent electrical insulation, compressibility and a naturally tacky surface. Designed for heat transfer through gaps, they fill the space between heat-generating components and heat sinks, completing heat transfer from the heat source to the cooling solution. They also provide insulation, vibration damping and sealing, meeting the design requirements of compact and ultra-thin electronic devices.
With excellent processability, a wide range of available thicknesses and strong conformability, they are an ideal gap-filling thermal material widely used in electronic and electrical products.
Key performance features
- Efficient thermal conduction — 1–7 W/m·K for reliable heat transfer.
- Low deformation force — protects electronic components more effectively.
- High-tack surface — lowers contact thermal resistance.
- Softness & compressibility — conforms to uneven gaps and surfaces.
- High electrical insulation — safe for direct contact with components.
- Vibration damping & sealing — additional protection in assembled devices.
- Wide thickness range — 0.10–15.0 mm options.
- Custom die-cutting — sizes cut to your exact requirements.
Typical specifications
| Thermal conductivity | 1 – 7 W/m·K (grades customizable) |
| Thickness | 0.10 – 15.0 mm |
| Surface | Naturally tacky |
| Compliance | RoHS, halogen-free, HF-controlled |
| Customization | Die-cut to size per customer drawing |
| Application | Electronic and electrical products |
| Volume | From prototype samples to high-volume production |
Typical applications
- Computers — thermal management in desktops and laptops.
- Power supply modules — heat transfer in power conversion systems.
- High-speed mass storage drives — SSDs and enterprise storage.
- Flat panel displays — uniform heat spreading in display modules.
- Network communication equipment — switches, routers and base stations.
- Power conversion equipment — inverters and converters.
- LCD backlight modules — thermal management in backlight units.
Frequently asked questions
What is the thermal conductivity of these pads?
1 – 7 W/m·K, confirmed on the material datasheet for each grade.
Can the pads be cut to custom sizes?
Yes. As a precision die-cutting manufacturer, we cut the pads to your exact dimensions, from single prototypes to mass production.
What thicknesses are available?
0.10–15.0 mm, selectable according to your application.
Are the materials compliant with environmental standards?
Yes. This series complies with RoHS, halogen-free and HF-controlled requirements.
Send us your application details and we confirm the right grade, thickness and quotation. Samples available within 3–7 days.