Polyimide (PI) High-Temperature Tape Die Cutting
Our polyimide (PI) high-temperature tape is a polyimide-film insulating tape with a high-temperature silicone pressure-sensitive adhesive. Standard thicknesses are 25 μm and 50 μm, rated −269 °C to +260 °C continuous, Class H, UL94 V-0, and leaves no residue after soldering. We die cut it into masks, pads and insulating parts to your drawings. As a PI tape die-cutting supplier and OEM converter, we also support custom widths, shapes and packaging for electronics insulation programs — from prototype to production volume.
Why PI tape
- Extreme temperature range — survives SMT reflow (peak ~260 °C) and cryogenic use.
- Electrical insulation — high dielectric strength for Class H systems.
- Residue-free removal — clean peel after soldering, no silicone or adhesive left behind.
- Flame retardant — UL94 V-0.
Typical capabilities
| Standard thickness | 25 μm (fine-pitch) / 50 μm (general insulation) |
| Temperature range | −269 °C to +260 °C continuous |
| Dielectric strength | ~7,000 V for 25 μm film |
| Flame rating | UL94 V-0 |
| Die-cut tolerance | ±0.05 – 0.3 mm |
| Presentation | Kiss-cut on liner, tape-and-reel, sheets |
Applications
- PCB gold-finger masking — protect contact fingers during wave/reflow soldering.
- SMT reflow protection — mask pads and components during reflow.
- Lithium battery insulation — cell tab and wrap insulation.
- Motor/transformer winding — Class H electrical insulation.
- Aerospace harnesses — high-temp wire bundling.
FAQ
25 μm or 50 μm — which should I use?
Pick 25 μm for fine-pitch masking where conformability matters; 50 μm for general insulation and mechanical protection.
Does it leave adhesive residue after reflow?
No — the high-temp silicone PSA is formulated for clean removal after SMT profiles.
Send your mask drawing and we cut free PI tape samples for your reflow profile test.