How to Select Double-Sided Tape for High-Temperature Applications
Double-sided tape failures at high temperature usually have one root cause: the datasheet's "continuous use temperature" was confused with peak exposure, or the wrong substrate was chosen. This is the decision process we walk customers through when the application sees reflow, IR reflow, under-hood or near-heat-source conditions.
1. Separate continuous vs peak temperature
A tape rated to 150 °C continuous will survive 260 °C for 60 seconds (typical SMT reflow profile per IPC J-STD-020). It will not survive an hour at 200 °C. Specify both numbers on your drawing: the steady-state operating temperature and the shortest thermal cycle the part must endure.
2. Substrate picks the ceiling
- PET carrier: good to ~150 °C continuous. Adequate for most consumer electronics.
- Polyimide (PI) carrier: good to ~260 °C continuous, the standard for reflow and heat-barrier applications.
- Acrylic foam (VHB): 90–150 °C depending on grade — check the specific part number, not the family.
- Silicone adhesive: required if the temperature exceeds what even a PI carrier can take, or if you need sterilisation resistance.
3. Don't forget surface prep
High-temperature bonds fail more often from outgassing or oily contamination than from adhesive chemistry. Isopropyl alcohol cleaning and, on low-energy plastics, a corona or plasma treat step matters more at temperature than selecting a "hotter" grade.
Run a thermal cycle test on a die-cut sample before locking the BOM. We produce free prototypes so you can verify the bond in your own thermal chamber.
Request a high-temperature sample →